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Development and design services - メーカー・企業45社の製品一覧とランキング

更新日： 集計期間:Sep 17, 2025～Oct 14, 2025
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Development and design servicesのメーカー・企業ランキング

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  1. スマートエナジー研究所 Kanagawa//Industrial Electrical Equipment
  2. 穂高電子 Kanagawa//Testing, Analysis and Measurement
  3. Mywayプラス Kanagawa//Industrial Electrical Equipment
  4. 4 マイクロネット　信州事業所　 Nagano//software
  5. 5 Integra System Kumamoto//IT/Telecommunications
企業ランキングへ

Development and design servicesの製品ランキング

更新日： 集計期間:Sep 17, 2025～Oct 14, 2025
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  1. High-speed circuit simulator for power electronics "Scideam" スマートエナジー研究所
  2. Scideam High-Speed Circuit Simulator Compatible with MATLAB and JMAG 穂高電子
  3. Power Electronics Circuit Simulator PSIM Mywayプラス
  4. Circuit simulator Scideam equipped with SiC/GaN device models. 穂高電子
  5. 4 Electronic Circuit Simulator CircuitViewer5 マイクロネット　信州事業所　

Development and design servicesの製品一覧

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Temperature control of flow ovens and reflow ovens: Reducing solder adhesion defects and improving efficiency!

Temperature control of flow ovens and reflow ovens: Reducing solder adhesion defects and improving efficiency!

Predicting temperature rise in reflow and flow furnaces through simulation! Aiming to reduce solder adhesion defects and improve the efficiency of the assembly process.

Soldering is a traditional technology, but due to environmental pollution measures (RoHS directive), lead-free solder with different characteristics from the previously mainstream lead solder has started to be used. This, along with requests from product development, has necessitated a review of manufacturing conditions and methods. To manufacture higher quality products, it is essential to anticipate potential issues in the manufacturing process from the development stage and to establish countermeasures. This is where thermal simulation technology is gaining significant attention! For customers who already have experience or technology in thermal simulation, we offer solutions centered around the introduction of tools such as FloTHERM and FloTHERM PCB. For customers without experience in thermal simulation who need to build their technology, we propose solutions focused on thermal design consulting. Thermal simulation related to soldering can yield significantly different results depending on the solder material, electronic components, and manufacturing conditions, so it is not possible to universally present the best conditions. We will propose solutions that can provide results tailored to your products, so please feel free to contact us.

  • 企業：IDAJ
  • 価格：Other
  • Thermo-fluid analysis
  • Contract Analysis
  • Structural Analysis

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『TL494』

『TL494』

Pulse Width Modulation (PWM) Control Circuit 'TL494'

The TL494 device integrates all the functions necessary for building pulse width modulation (PWM) control circuits into a single chip. Primarily designed for power control, this device can be flexibly adjusted to suit specific applications. The TL494 device features an on-chip adjustable oscillator, dead time control (DTC) comparator, pulse steering control flip-flop, a 5V regulator with 5% accuracy, and two error amplifiers for output control circuits. 【Features】 ■ Integration of all functions required for PWM control circuits ■ Built-in two error amplifiers, variable oscillator, dead time control comparator, pulse steering control flip-flop, 5V regulator with 5% accuracy, and output control circuit ■ Output operation can be push-pull or single-ended ■ Operating temperature range: 0 to 70°C or -40 to +85°C *For more details, please contact us.

  • Other semiconductors
  • Other power sources
  • converter

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Power Electronics Circuit Simulator PSIM

Power Electronics Circuit Simulator PSIM

This is recommended for those who want to easily and quickly consider the specifications and simulate both the motor and the inverter together.

PSIM is a circuit simulator developed for power electronics and motor control. It provides a powerful simulation environment for analyzing power electronics, designing control circuits, and researching inverters and motor drives, thanks to its high-speed simulation, user-friendly interface, and waveform analysis features. It is used in a wide range of industrial fields, including automotive, home appliances, aerospace, and renewable natural energy (such as wind power and solar power), for the verification of various applications such as switching power supplies, motor drives, and power conversion devices. For more details, please download the catalog or contact us.

  • Inverter

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Basic Fundamentals: "Smith Chart"

Basic Fundamentals: "Smith Chart"

You will be able to easily perform complex complex calculations on charts.

Including transmission lines, solving various problems in high-frequency circuits using mathematical formulas becomes quite cumbersome due to complex calculations. However, by using the Smith chart devised by P. H. Smith, it becomes possible to easily perform such complex calculations graphically. With a slide rule, the property that multiplication can be replaced by addition when taking logarithms is utilized, allowing for easy multiplication by simply moving the slide. Similarly, the Smith chart is a convenient tool that uses conformal mapping to simplify high-frequency calculations. 【Features】 ○ When the load impedance Zr is not equal to the line impedance Z0, part of the incident wave returns to the source side as a reflected wave. ○ Standing waves appear on the line due to the interference between the reflected wave and the incident wave. ○ The ratio of the reflected wave to the incident wave is called the voltage reflection coefficient, generally represented by Γ or Γv. For more details, please contact us or download the catalog.

  • others

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General Fundamentals Edition: "Operation of Nonlinear Circuits"

General Fundamentals Edition: "Operation of Nonlinear Circuits"

The output changes in the form of a line, that is, a straight line, in response to the input.

A linear element, as the name suggests, is one where the output changes in a linear manner, that is, in the form of a straight line, in response to the input. For example, considering a resistor, the current flowing through the resistor is given by Ir = Vr/R = G･Vr, which is a linear function proportional to the voltage across the resistor. Elements that have this kind of input-output relationship are called linear elements. [Points] ○ A capacitor also follows Ic = jωC･Vc, which is again a linear function of Vc. ○ A nonlinear element refers to one where the output characteristics are not a linear function of the input. For more details, please contact us or download the catalog.

  • others

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General Fundamentals: Large Signal S-Parameter Analysis Method Using S-NAP/Pro

General Fundamentals: Large Signal S-Parameter Analysis Method Using S-NAP/Pro

Create a linear equivalent circuit and perform linear analysis including surrounding elements.

When a large signal is input into a circuit, it is a well-known fact that the S-parameters of the circuit differ from those in the small signal case if there are nonlinear elements present. In S-parameter analysis, the treatment of active devices generally involves creating linear equivalent circuits such as hybrid pi models at the bias point from models like the Gummel-Poon model, and performing linear analysis including surrounding elements. The linear equivalent circuit at the bias point maintains a linear input-output relationship regardless of how distorted the bias point may be, and does not introduce distortion in the output. To investigate the circuit characteristics when a large signal is input or when the bias point lies in a higher-order curve region, it is best to calculate the S-parameters from the input-output ratio of the fundamental wave component while in the state of large signal input. S-NAP-Pro does not have a direct function to obtain large signal S-parameters, but it is possible to achieve this using harmonic balance. [Features] - Create circuits with ports similar to S-parameter analysis - Label the terminals of each port in the circuit For more details, please contact us or download the catalog.

  • others

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General Foundation Edition "Method for Exchange of Reference Plane for Measured Data"

General Foundation Edition "Method for Exchange of Reference Plane for Measured Data"

Method for exchanging reference planes of measured data using S･NAP-Pro.

When measuring the characteristics of transmission lines, unwanted elements such as connectors and coaxial lines at the connection point between the calibration reference plane of the network analyzer and the device under test may be mixed into the measurement data. Ideally, it would be best to perform calibration at the device under test end as the calibration reference plane of the network analyzer, but in practice, this is often difficult due to the constraints of calibration fixtures. If it is challenging to remove unwanted elements during measurement, it is necessary to eliminate these elements through post-processing to obtain accurate data for the device under test. In many cases, these unwanted elements are connectors or coaxial lines, and if the data for these elements is known, it is possible to remove them using S･NAP-Pro after measurement. [Features] - If the data is known, unwanted elements can be easily subtracted from the measurement data. - The attenuation per unit length can be 'zero' if the length is short. For more details, please contact us or download the catalog.

  • others

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Thermal simulation, thermal analysis (heat sink, thermal measurement)

Thermal simulation, thermal analysis (heat sink, thermal measurement)

Patent No. 5232289! Holds technology that accurately reflects the thermal characteristics of semiconductor components. Thermal simulation, thermal analysis (heat sinks, thermal measurements).

Are you facing thermal issues in product development? We can help solve that problem. Thermal simulation and thermal analysis (heat sinks, thermal measurements). When conducting simulations, expertise is required for modeling semiconductor components. WTI possesses technology that accurately reflects the thermal characteristics of semiconductor components, which are the heat sources, allowing for simulations that are close to actual measurements. [Features] ■ High-precision reflection of the thermal characteristics of semiconductor components, which are the heat sources ■ Simulations that are close to actual measurements ■ Patent No. 5232289 *For more details, please refer to the PDF document or feel free to contact us.

  • Other inspection equipment and devices
  • Circuit Board Inspection Equipment
  • Other semiconductors

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FPGA design outsourcing services

FPGA design outsourcing services

We will propose an FPGA design suitable for your product!

In our "FPGA Design Contract Service," we propose suitable FPGA designs from both hardware and software perspectives. In the FPGA development flow, we conduct joint reviews with customers at each step. We ensure quality not only through logical verification but also by performing actual device verification. 【Features】 ■ Proposing suitable FPGA designs from both hardware and software perspectives ■ Supporting EOL (End of Life) responses even when design documentation is not available through reverse analysis ■ Ensuring quality through both logical verification and actual device verification *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other contract services
  • ASIC

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Stress simulation service (analysis) vibration, impact, drop, durability

Stress simulation service (analysis) vibration, impact, drop, durability

Are you struggling to respond to issues with the temperature cycle testing of your products? (Analysis) Vibration, shock, drop, durability.

The "Stress Simulation Service" uses a model that takes package structure into account to improve lifespan in temperature cycle testing. (Analysis) Vibration, impact, drop, durability In temperature cycle simulation, lifespan predictions are made through simulations that consider package structure, and improvement proposals aimed at reliability are suggested. Additionally, in vibration simulation, issues caused by vibrations during transport and operation are resolved, while drop and impact simulations address problems related to drop impacts on semiconductor component connections. 【Features】 ■ Improvement of lifespan in temperature cycle testing using a model that considers package structure ■ Reduction of loss costs in the range of millions of yen caused by additional prototypes and evaluations ■ Resolution of issues caused by vibrations during transport and operation (actual usage conditions) ■ Resolution of issues related to drop impacts on semiconductor component connections (solder) *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Impact Test
  • Vibration Testing

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High-frequency power supply board that can confirm the operation of wireless power transmission.

High-frequency power supply board that can confirm the operation of wireless power transmission.

Up to 50W output is possible! It can be used for practical evaluations incorporated into your products.

We would like to introduce our "High-Frequency Power Board." By using our wireless power evaluation high-frequency power board and reference antenna, you can confirm the operation of wireless power transmission. The high-frequency power board can output up to 50W, and with the reference antenna, it can operate with a load of up to 35W at a power transmission distance of 40mm. We also accommodate custom antenna designs according to your requests, so please feel free to contact us when needed. 【Features】 ■ Uses our wireless power evaluation high-frequency power board and reference antenna ■ High-frequency power board can output up to 50W ■ Reference antenna can operate with a load of up to 35W at a power transmission distance of 40mm ■ Operates LED tape (12V) and fan (5V) as loads ■ The output start switch allows you to toggle the LED and fan On/Off by waving your hand *For more details, please refer to the PDF document or feel free to contact us.

  • Embedded system design service
  • Circuit board design and manufacturing
  • Printed Circuit Board

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[Data] Shirutoku Report No. 89 # Transfer Functions Required for Power Control Circuit Design

[Data] Shirutoku Report No. 89 # Transfer Functions Required for Power Control Circuit Design

This explains the overview of transfer functions and illustrates the transfer function when incorporating phase compensation with diagrams!

★★Shirutoku Report: Useful Information You Should Know★★ This time, I would like to continue discussing the topic related to transfer functions that I briefly touched on last time. A transfer function, as mentioned in the title, is knowledge necessary for the design of power supply control circuits. Phase compensation can also be considered a control circuit in terms of controlling circuit oscillation. We have also included a simple overview of transfer functions. Please take a moment to read it. [Contents] ■ Overview of Transfer Functions ■ Transfer Functions with Phase Compensation Incorporated *For more details, please refer to the PDF document or feel free to contact us.

  • power supply

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[Data] Shirutoku Report No. 93 # Heat Simulation Cannot Be Done Easily

[Data] Shirutoku Report No. 93 # Heat Simulation Cannot Be Done Easily

Important tools! Here are the two major challenges in thermal simulation.

★★Shirutoku Report: Useful Information You Should Know★★ The Structural Design Department is broadly divided into simulation (thermal, stress) and mechanism design, and I am in charge of thermal simulation. I started with almost no knowledge of heat. Through daily learning, the simulation that visualizes the invisible "heat" is an important tool for solving and preventing various thermal issues, and I am currently learning its fundamentals. There are two major challenges in thermal simulation. Let me explain the reasons. [Contents] ■ Two Challenges in Thermal Simulation ■ Temperature Distribution Diagram Around Heat Sources (Simulation Results) *For more details, please refer to the PDF document or feel free to contact us.

  • simulator

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Development of semiconductor and electronic fields

Development of semiconductor and electronic fields

Our company has experienced developers of key devices for products such as automotive and communication SoCs, supporting clients in advanced development and design.

We provide solutions specialized in the electronic and semiconductor fields, including semiconductor (LSI) logic development, process development, liquid crystal (LCD) driver development, and automotive ECU development.

  • Circuit board design and manufacturing

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Leave noise and thermal countermeasures for analog circuits to Kairoski.

Leave noise and thermal countermeasures for analog circuits to Kairoski.

Over 1,000 development achievements! We are committed to development without compromise, with the motto of "as much as possible in one go." Please feel free to reach out to us.

We have expertise in high-reliability power supplies, high-voltage power supplies, and high-efficiency power supplies. We have extensive experience in the control and driver development of brushless motors and stepping motors! **Examples of problems we can solve:** - We want to verify the current circuit during development and improve reliability as much as possible. - To shorten the development period, we want to enhance the completeness of the prototype PCB as much as possible. - We want to address circuit configuration, PCB noise countermeasures, and thermal countermeasures as much as possible. - We would like to consult about troubleshooting related to analog circuits and their countermeasures. - We want to connect with a circuit design company that has development experience, knowledge, and theories in various industries. And more... *For more details, please refer to the PDF document or feel free to contact us. *This information is as of January 2023.

  • power supply
  • Sensors
  • Other power sources

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